View 7SB3257DTT2G_8418687.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

? semiconductor components industries, llc, 2014 september, 2014 ? rev. 4 1 publication order number: 7sb3257/d 7sb3257 mux / demux bus switch the 7sb3257 mux / demux bus switch is an advanced high?speed line switch in ultra?small footprint. features ? high speed: t pd = 0.25 ns (max) @ v cc = 4.5 v ? 3 switch connection between 2 ports ? power down protection provided on inputs ? ultra?small packages ? nlv prefix for automotive and other applications requiring unique site and control change requirements; aec?q100 qualified and ppap capable ? these devices are pb?free, halogen free/bfr free and are rohs compliant figure 1. logic diagram figure 2. tsop?6/sc?88 (top view) b0 s b1 b0 gnd v cc a 1 2 3 6 4 b1 b0 gnd s a v cc 1 2 3 6 5 4 figure 3. ullga6/udfn6 (top view) a b1 5 s function table input s function l a = b0 h a = b1 see detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. ordering information marking diagrams http://onsemi.com 1 1 1 ullga6 1.0 x 1.0 case 613ad ullga6 1.2 x 1.0 case 613ae ullga6 1.45 x 1.0 case 613af k m 6 1 6 ag m (note: microdot may be in either location) ak, ag, k, d, l = specific device code m = date code = pb?free package tsop?6 dt suffix case 318g sot?363/sc70?6/sc?88 df suffix case 419b 6 ak m m m 1 6 udfn6 1.2 x 1.0 case 517aa l m 1 d d 1 1 1 udfn6 1.45 x 1.0 case 517aq xm 1 udfn6 1.0 x 1.0 case 517bx x m
7sb3257 http://onsemi.com 2 table 1. maximum ratings symbol parameter value unit v cc dc supply voltage ?0.5 to +7.0 v v in control pin input voltage ?0.5 to +7.0 v v i/o switch input / output voltage ?0.5 to +7.0 v i ik control pin dc input diode current v in < gnd ?50 ma i ok switch i/o port dc diode current v i/o < gnd ?50 ma i o on?state switch current 128 ma continuous current through v cc or gnd 150 ma i cc dc supply current per supply pin 150 ma i gnd dc ground current per ground pin 150 ma t stg storage temperature range ?65 to +150 c t l lead temperature, 1 mm from case for 10 seconds 260 c t j junction temperature under bias 150 c ja thermal resistance sc?88 / tsop?6 (note 1) ullga6/udfn6 333 496 c/w p d power dissipation in still air at 85 c sc?88 / tsop?6 (note 1) ullga6/udfn6 200 252 mw msl moisture sensitivity level 1 f r flammability rating oxygen index: 28 to 34 ul 94 v?0 @ 0.125 in v esd esd withstand voltage human body mode (note 2) machine mode (note 3) charged device mode (note 4) >2000 >200 n/a v i latchup latchup performance above v cc and below gnd at 85 c (note 5) 100 ma stresses exceeding those listed in the maximum ratings table may damage the device. if any of these limits are exceeded, device function ality should not be assumed, damage may occur and reliability may be affected. 1. measured with minimum pad spacing on an fr4 board, using 10 mm?by?1 inch, 2 ounce copper trace no air flow. 2. tested to eia/ jesd22?a1 14?a 3. tested to eia/ jesd22?a1 15?a 4. tested to jesd22?c101?a 5. tested to eia / jesd78. table 2. recommended operating conditions symbol parameter min max unit v cc positive dc supply voltage 4.0 5.5 v v i control pin input voltage 0 5.5 v v i/o switch input / output voltage 0 5.5 v t a operating free?air temperature ?55 +125 c t / v input transition rise or fall rate control input switch i/o 0 0 5 dc ns/v functional operation above the stresses listed in the recommended operating ranges is not implied. extended exposure to stresse s beyond the recommended operating ranges limits may affect device reliability.
7sb3257 http://onsemi.com 3 table 3. dc electrical characteristics symbol parameter conditions v cc (v) t a = 25 c t a = ?55 c to +125 c unit min typ max min max v ik clamp diode voltage i in = ?18 ma 4.5 ?1.2 ?1.2 v v ih high?level input voltage (control) 4.0 to 5.5 2.0 2.0 v v il low?level input voltage (control) 4.0 to 5.5 0.8 0.8 v i in input leakage current 0 v in 5.5 v 5.5 0.1 1.0 a i off power off leakage current v i/o = 0 to 5.5 v 0 0.1 1.0 a i cc quiescent supply current i o = 0, v in = v cc or 0 v 5.5 0.1 1.0 a i cc increase in supply current (control pin) one input at 3.4 v; other inputs at v cc or gnd 5.5 2.5 ma r on switch on resistance v i/o = 0, i i/o = 64 ma i i/o = 30 ma 4.5 3 3 7 7 7 7 v i/o = 2.4, i i/o = 15 ma 4.5 6 15 15 v i/o = 2.4, i i/o = 15 ma 4.0 10 20 20 product parametric performance is indicated in the electrical characteristics for the listed test conditions, unless otherwise noted. product performance may not be indicated by the electrical characteristics if operated under different conditions. table 4. ac electrical characteristics symbol parameter v cc (v) test condition t a = 25 c t a = ?55 c to +125 c unit min typ max min max t pd propagation delay, a to b or b to a 4.0 to 5.5 see figure 4 0.25 0.25 ns t en output enable time 4.5 to 5.5 0.8 2.5 4.2 0.8 4.2 ns 4.0 0.8 3.0 4.6 0.8 4.6 t dis output disable time 4.5 to 5.5 0.8 3.1 4.8 0.8 4.8 ns 4.0 0.8 2.9 4.4 0.8 4.4 c in control input capacitance 5.0 v in = 3 v or 0 2.0 pf c io(on) switch on capacitance 5.0 switch on 10 pf c io(off) switch off capacitance 5.0 switch off 3.5 pf
7sb3257 http://onsemi.com 4 ac loading and waveforms figure 4. load circuit and voltage waveforms 500 c l = 50 pf (see note a) 7 v from output under test 500 s1 open gnd load circuit test s1 t pd t plz /t pzl t phz /t pzh open 7 v gnd input 1.5 v 1.5 v 1.5 v 1.5 v t plh t phl output 3 v v oh 0 v v ol voltage waveforms propagation delay times t pzl 3 v 1.5 v 1.5 v 0 v output control t plz t pzh t phz 1.5 v 1.5 v 3.5 v 0 v v ol v oh v ol + 0.3 v v oh ? 0.3 v output waveform 1 s1 at 7 v (see note b) output waveform 2 s1 at open (see note b) voltage waveforms enable and disable times a. c l includes probe and jig capacitance. b. waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output contro l. waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output cont rol. c. all input pulses are supplied by generators having the following characteristics: prr 10 mhz, z o = 50 , t r 2.5 ns, t f 2.5 ns. d. the output is measured with one input transition per measurement. e. t plz and t phz are the same as t dis . f. t pzl and t pzh are the same as t en . g. t plh and t phl are the same as t pd . device ordering information device package shipping ? 7sb3257dtt1g tsop?6 (pb?free) 3000 / tape & reel nlv7sb3257dtt1g* 7SB3257DTT2G 7sb3257dft2g sc?88 (pb?free) 3000 / tape & reel 7sb3257amx1tcg ullga6 ? 1.45 x 1.0, 0.5p (pb?free) 3000 / tape & reel 7sb3257bmx1tcg ullga6 ? 1.2 x 1.0, 0.4p (pb?free) 3000 / tape & reel 7sb3257cmx1tcg ullga6 ? 1.0 x 1.0, 0.35p (pb?free) 3000 / tape & reel 7sb3257mu1tcg udfn6 ? 1.45 x 1.0, 0.5p (pb?free) 3000 / tape & reel 7sb3257mutcg udfn6 ? 1.2 x 1.0, 0.4p (pb?free) 3000 / tape & reel 7sb3257mu3tcg udfn6 ? 1.0 x 1.0, 0.35p (pb?free) 3000 / tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d. *nlv prefix for automotive and other applications requiring unique site and control change requirements; aec?q100 qualified and ppap capable.
7sb3257 http://onsemi.com 5 package dimensions tsop?6 case 318g?02 issue u 23 4 5 6 d 1 e b e1 a1 a 0.05 notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. maximum lead thickness includes lead finish. minimum lead thickness is the minimum thickness of base material. 4. dimensions d and e1 do not include mold flash, protrusions, or gate burrs. mold flash, protrusions, or gate burrs shall not exceed 0.15 per side. dimensions d and e1 are determined at datum h. 5. pin one indicator must be located in the indicated zone. c *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* dim a min nom max millimeters 0.90 1.00 1.10 a1 0.01 0.06 0.10 b 0.25 0.38 0.50 c 0.10 0.18 0.26 d 2.90 3.00 3.10 e 2.50 2.75 3.00 e 0.85 0.95 1.05 l 0.20 0.40 0.60 0.25 bsc l2 ? 0 1 0 1.30 1.50 1.70 e1 e recommended note 5 l c m h l2 seating plane gauge plane detail z detail z 0.60 6x 3.20 0.95 6x 0.95 pitch dimensions: millimeters m
7sb3257 http://onsemi.com 6 package dimensions sc?88/sc70?6/sot?363 case 419b?02 issue w notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. 419b?01 obsolete, new standard 419b?02. e 0.2 (0.008) mm 123 d e a1 a a3 c l 654 ?e? b 6 pl dim min nom max millimeters a 0.80 0.95 1.10 a1 0.00 0.05 0.10 a3 b 0.10 0.21 0.30 c 0.10 0.14 0.25 d 1.80 2.00 2.20 0.031 0.037 0.043 0.000 0.002 0.004 0.004 0.008 0.012 0.004 0.005 0.010 0.070 0.078 0.086 min nom max inches 0.20 ref 0.008 ref h e h e e 1.15 1.25 1.35 e 0.65 bsc l 0.10 0.20 0.30 2.00 2.10 2.20 0.045 0.049 0.053 0.026 bsc 0.004 0.008 0.012 0.078 0.082 0.086 mm inches scale 20:1 0.65 0.025 0.65 0.025 0.50 0.0197 0.40 0.0157 1.9 0.0748 *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint*
7sb3257 http://onsemi.com 7 package dimensions udfn6 1.0x1.0, 0.35p case 517bx issue o soldering footprint* recommended dim min max millimeters a 0.45 0.55 a1 0.00 0.05 a3 0.13 ref b 0.12 0.22 d 1.00 bsc e 1.00 bsc e 0.35 bsc l 0.25 0.35 l1 0.30 0.40 a b e d 0.10 c pin one reference top view 0.10 c a a1 0.05 c 0.05 c c seating plane side view 2x 2x a3 bottom view b e 6x 0.10 b 0.05 a c c l 5x note 3 l1 1 3 4 6 m m dimensions: millimeters 0.22 5x 0.48 6x 1.18 0.53 pitch 0.35 1 pkg outline
7sb3257 http://onsemi.com 8 package dimensions udfn6 1.2x1.0, 0.4p case 517aa issue c notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimension b applies to plated terminal and is measured between 0.25 and 0.30 mm from terminal. 4. coplanarity applies to the exposed pad as well as the terminals. a b e d bottom view b e 6x 0.10 b 0.05 a c c l 5x note 3 2x 0.10 c pin one reference top view 2x 0.10 c 10x a a1 (a3) 0.08 c 0.10 c c seating plane side view l2 1 3 4 6 dim min max millimeters a 0.45 0.55 a1 0.00 0.05 a3 0.127 ref b 0.15 0.25 d 1.20 bsc e 1.00 bsc e 0.40 bsc l 0.30 0.40 l1 0.00 0.15 mounting footprint* dimensions: millimeters 0.22 6x 0.42 6x 1.07 0.40 pitch *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. l1 detail a bottom view (optional) 0.40 0.50
7sb3257 http://onsemi.com 9 package dimensions udfn6 1.45x1.0, 0.5p case 517aq issue c notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimension b applies to plated terminal and is measured between 0.15 and 0.30 mm from the terminal tip. a b e d bottom view b e 6x 0.10 b 0.05 a c c l 6x note 3 0.10 c pin one reference top view 0.10 c 6x a a1 0.05 c 0.05 c c seating plane side view 1 3 4 6 dim min max millimeters a 0.45 0.55 a1 0.00 0.05 b 0.20 0.30 d 1.45 bsc e 1.00 bsc e 0.50 bsc l 0.30 0.40 l1 ??? 0.15 dimensions: millimeters 0.30 6x 1.24 0.53 pitch *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. 0.50 1 mounting footprint package outline l1 detail a l optional constructions l 0.07 ref 6x a2 detail b detail a
7sb3257 http://onsemi.com 10 package dimensions ullga6 1.0x1.0, 0.35p case 613ad issue a notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimension b applies to plated terminal and is measured between 0.15 and 0.30 mm from the terminal tip. 4. a maximum of 0.05 pull back of the plated terminal from the edge of the package is allowed. a b e d bottom view b e 6x 0.10 b 0.05 a c c l 5x note 3 0.10 c pin one reference top view 0.10 c 6x a a1 0.05 c 0.05 c c seating plane side view l1 1 3 4 6 dim min max millimeters a ??? 0.40 a1 0.00 0.05 b 0.12 0.22 d 1.00 bsc e 1.00 bsc e 0.35 bsc l 0.25 0.35 l1 0.30 0.40 note 4 soldermask defined* dimensions: millimeters 0.22 5x 0.48 6x 1.18 0.53 pitch *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. 0.35 1 mounting footprint pkg outline
7sb3257 http://onsemi.com 11 package dimensions ullga6 1.2x1.0, 0.4p case 613ae issue a notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimension b applies to plated terminal and is measured between 0.15 and 0.30 mm from the terminal tip. 4. a maximum of 0.05 pull back of the plated terminal from the edge of the package is allowed. a b e d bottom view b e 6x 0.10 b 0.05 a c c l 5x note 3 0.10 c pin one reference top view 0.10 c 6x a a1 0.05 c 0.05 c c seating plane side view l1 1 3 4 6 dim min max millimeters a ??? 0.40 a1 0.00 0.05 b 0.15 0.25 d 1.20 bsc e 1.00 bsc e 0.40 bsc l 0.25 0.35 l1 0.35 0.45 note 4 soldermask defined* dimensions: millimeters 0.26 5x 0.49 6x 1.24 0.53 pitch *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. 0.40 1 mounting footprint pkg outline
7sb3257 http://onsemi.com 12 package dimensions ullga6 1.45x1.0, 0.5p case 613af issue a notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimension b applies to plated terminal and is measured between 0.15 and 0.30 mm from the terminal tip. 4. a maximum of 0.05 pull back of the plated terminal from the edge of the package is allowed. a b e d bottom view b e 6x 0.10 b 0.05 a c c l 5x note 3 0.10 c pin one reference top view 0.10 c 6x a a1 0.05 c 0.05 c c seating plane side view l1 1 3 4 6 dim min max millimeters a ??? 0.40 a1 0.00 0.05 b 0.15 0.25 d 1.45 bsc e 1.00 bsc e 0.50 bsc l 0.25 0.35 l1 0.30 0.40 note 4 soldermask defined* dimensions: millimeters 0.30 5x 0.49 6x 1.24 0.53 pitch *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. 0.50 1 mounting footprint pkg outline on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves th e right to make changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?t ypicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license un der its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended f or surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in a ny manner. 7sb3257/d p ublication ordering information n. american technical support : 800?282?9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81?3?5817?1050 literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loc al sales representative

▲Up To Search▲

Price & Availability of 7SB3257DTT2G

	To Download 7SB3257DTT2G Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .